Director
Posted 29 Sep 2026
Advertised as “Director, SI/PI”
BranchFactor Summary
The original posting with the fluff stripped out
- Management level
- People management
- Employment
- On-Site
- Contract
- Full-time
- Visa sponsorship
- Offered
No salary listed for this role.
Field of studyElectrical Engineering
Study levelMaster's or higher
About the Role
We are seeking a Director to drive Signal Integrity, Power Integrity of our first generation MPU. It involves all aspects for SI/PI from silicon to system.
This role will be performed onsite from one of our offices in Santa Clara, CA or Boston, MA.
Essential Duties & Responsibilities
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Responsible for technical solution development for Signal Integrity and Power Integrity.
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Drive system-level SI/PI architecture, design guidelines, and layout recommendations.
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Perform end-to-end channel simulations for high-speed serial interfaces and memory subsystems.
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Lead SI/PI analysis and optimization of DDR5, LPDDR5, LPDDR6, and other high-performance memory interfaces.
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Correlate simulations with lab measurements and drive root-cause analysis of signal and power integrity issues.
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Collaborate with silicon, package, PCB, architecture, and manufacturing teams to resolve complex SI/PI challenges.
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Evaluate future package and PCB technologies to support next-generation FPGA and adaptive computing products
Qualifications
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MS or PhD in Electrical Engineering
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5+ years of direct industry experience
Preferred Qualifications
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Excellent analytical and problem-solving skills with strong attention to detail.
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Proven ability to independently drive technical decisions and influence engineering direction.
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Strong communication and cross-functional collaboration skills.
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Hands-on experience performing lab measurements and correlating hardware results to simulation models.
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Deep expertise in Signal Integrity with working knowledge of Power Integrity concepts and methodologies.
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Experience with DDR, LPDDR, or other high-performance memory interfaces.
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Experience with FPGA, adaptive computing, ASIC, networking, datacenter, or high-performance computing platforms.
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Experience with PCB, package, and IC-level power delivery networks.
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Expertise with SI/PI analysis tools including ADS and HFSS; experience with HSPICE is a plus.
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Strong foundation in electromagnetic theory, transmission lines, and circuit analysis.