Interposer System Design Analyst & Integration Engineer

HRL Laboratories, an IBM company, pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers to help them remove limitations and create competitive advantage. HRL then transitions the work back to customers – ready for real-world application. For more than 70 years, HRL’s rich portfolio of scientific discoveries and engineering innovations continues to build on each other — often in unexpected, profound and far-reaching ways. As a private company owned by IBM, HRL prioritizes purpose over profit, significantly advancing the state of the art. 

Qubit Systems Laboratory (QSL) is a world leader in semiconductor spin qubits. Our broad expertise spans semiconductor growth, device design and modeling, cryogenic control, high-density interconnects and packaging, quantum architecture, and multiqubit demonstrations. Our system architecture is built entirely around scalable semiconductor manufacturing to make quantum computing affordable for practical business and scientific applications.

General Description
The Interposer System Design Analyst & Integration Engineer will develop, model, and validate the thermal and mechanical behavior of superconducting interposer systems operating in deep cryogenic environments in support of HRL’s silicon spin quantum computing efforts, and will develop metrology and verification plans and techniques for ensuring these components meet target requirements. This role requires expertise in computational modeling, hands on manufacturing experience, and cross functional coordination to ensure robust system level performance from millikelvin to 4 K. The ideal candidate brings strong proficiency with FEM tools, cryogenic material modeling, and CAD based model creation, paired with excellent communication skills and the ability to translate complex analyses into clear recommendations.

Essential Duties
•    Develop and execute detailed thermal and mechanical finite element models to evaluate the behavior of superconducting interposers and associated packaging structures across cryogenic temperature ranges.
•    Build complex geometric and material models using CAD tools; generate mesh strategies, boundary conditions, and multi physics simulations appropriate for deep cryo operation.
•    Collaborate with teams performing relevant thermal and mechanical measurements to validate FEM predictions, characterize material responses, and identify discrepancies between modeled and measured behavior.
•    Analyze superconducting interposer materials—including silicon based, glass based, and hybrid architectures—to determine stress distributions, thermal gradients, and deformation behaviors at very low temperatures. •    Work collaboratively with process, packaging, and device engineering teams to ensure system level design choices align with cryogenic performance requirements and manufacturing constraints. •    Document simulation methodologies, material models, assumptions, and validation results while contributing to design reviews and cross functional integration discussions. •    Communicate technical findings, risks, and design implications clearly to senior management and collaborate with team members to drive data informed engineering decisions. •    Support development of cryogenic reliability strategies, including interface behavior, material compatibility, and failure mode mitigation informed by modeling outcomes.