Advanced Packaging & Integration

We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system.

In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.

Main Duties and Responsibilities

• Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.

• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.

• Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.

• Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.

• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.

• Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.

• Own relevant technical activities with external suppliers, OSATs, and research partners.

• Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.

Experience and Qualifications

Required

• Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.

• 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.

• Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.

• Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.

• Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.