Engineer

Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)

Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Location: Covington, GA

Job Type: Full-Time

Job Description:

This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.

Required Skills:

• FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks
• Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)
• Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticity
• Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states
• Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)
• Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modeling
• Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress
• Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)
• Ability to translate simulation results into actionable design rules for process/product engineering teams

Preferred Skills

• Experience with panel level packaging reliability prediction