Materials Engineer
US$90,000 – US$150,000 / yr base salary
Posted 1 Jul 2026
Advertised as “Dielectric and Polymer Materials Engineer”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 3+ yrs
- Management level
- Individual contributor
- Contract
- Full-time
| Base salary | US$90,000 – US$150,000 / yr |
|---|
Field of studyChemical Engineering, Electrical Engineering, Materials Science, Polymer Science (or related)
Study levelMaster's or higher
Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications
Location: Covington, GA
Job Type: Full-Time
About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
Job Description:
You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.
Key Responsibilities:
- Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
- Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
- Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
- Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
- Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
- Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
- Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms
Required Skills:
- Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB