System & Advanced Packaging Design
Posted 12 Oct 2026
Advertised as “System & Advanced Packaging Design Lead”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 5+ yrs
- Management level
- People management
- Employment
- Hybrid
No salary listed for this role.
Role Overview
We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers
Key Responsibilities
Technical Leadership & Execution
- Own package, PCB, and system-level signal integrity architecture for 200G+/lane copper interconnects (C2M, C2C, and cable assemblies) — from channel budgeting and topology definition through post-layout signoff and correlation with silicon measurements.
- Drive 2.5D/3D and heterogeneous package development for co-packaged driver, TIA, and optical engines, including substrate architecture, interposer/bridge evaluation, and die–package co-design with the SerDes and analog design teams.
- Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine.
- Define and manage the OSAT and substrate supplier strategy — technology selection, DFM reviews, JEDEC qualification, yield ramp, and HVM readiness.
- Own package-level power integrity and thermal strategy: PDN targets, decoupling plans, lid/TIM selection, and clear signoff criteria across programs.
- Coordinate cross-functional execution across silicon design, product/test engineering, systems hardware, and manufacturing partners; run design reviews and manage schedule and risk.
Hands-On Design
- Personally drive substrate stackup definition, ballmap/pinmap optimization, and high-density breakout and escape routing studies for high-speed designs.
- Perform 3D EM extraction and channel simulation (HFSS/Q3D, ADS or equivalent), S-parameter quality checks, and COM/IL/RL budgeting against IEEE 802.3 and OIF-CEI specifications.
- Build and correlate PDN and thermal models spanning die, package, and board.
- Lead lab characterization: VNA/TDR measurements, BER and eye-margin testing, model-to-measurement correlation, and failure analysis support.
- Author package design guidelines, review checklists, and reference collateral used across product programs.
Required Qualifications
Education & Experience
- Ph.D. in Electrical Engineering (or related) with 5+ years, OR M.S. with 8+ years of Advanced package development in high volume.