Mechanical Simulation Engineer

About SK hynix America:

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

Work Model: Onsite

**Job Overview:
**

SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. In this role, you will be at the forefront of semiconductor innovation, driving the mechanical integrity of next-generation packaging solutions (e.g., HBM, 2.5D/3D Heterogeneous Integration). You will utilize advanced numerical methods to predict and optimize the thermos-mechanical behavior of complex IC packages, ensuring high performance and structural robustness. Additionally, you will bridge the gap between package-level integrity and system-level performance, ensuring our packaging solutions are robustly integrated into data center rack architectures and consumer systems.

Responsibilities:

• Advanced FEA Modeling: Develop high-fidelity, non-linear Finite Element Analysis (FEA) models to characterize stress, strain, and warpage behavior in advanced semiconductor packages during assembly processes and reliability tests.
• Multi-Physics Analysis: Perform complex thermo-mechanical multi-physics simulations to evaluate the impact of thermal gradients on structural integrity and fatigue life.
• Design Optimization: Partner closely with package designers and process engineers to provide simulation-driven design directions, optimizing architectures for warpage control, solder joint reliability, and interfacial adhesion.
• Material Characterization: Define and implement material constitutive models (elastic, plastic, viscoelastic, etc.) for various packaging materials (EMC, Substrate, Silicon, TIM) and correlate simulation results with empirical data (e.g., Shadow Moire, DIC).
• Failure Analysis & Reliability: Predict potential failure modes (delamination, cracking, bump fatigue) and develop mitigation strategies to meet stringent industry reliability standards.
• Methodology Development: Establish and document standardized simulation workflows, advanced meshing techniques, and automation scripts to enhance simulation accuracy and throughput.