SOC Floorplan Lead

The Role   We are seeking a highly skilled and hands-on SoC Floorplan Lead to own the physical foundation of our next-generation AI and Data Center SoCs. In this critical role, you will be the bridge between architecture, logic design, and physical design. You will work hand-in-hand with Chip Architects and RTL Leads to influence micro-architecture and ensure the physical implementation achieves best-in-class Power, Performance, and Area (PPA). If you love solving complex spatial puzzles on advanced technology nodes, integrating sensitive analog components, and driving execution in a high-energy start-up environment, this is the role for you.   Key Responsibilities

• Top-Level Floorplanning: Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale AI/Data Center chips on advanced process nodes (e.g., 5nm, 3nm or below).
• Architecture & RTL Collaboration: Partner closely with Architecture and RTL teams to provide early physical feasibility feedback. Drive block partitioning, shape optimization, and data-flow planning to achieve the absolute best PPA.
• Bump & Package Co-Design: Lead bump planning and IO ring definition. Work with packaging teams on flip-chip/advanced packaging constraints, ensuring optimal signal escape and power delivery.
• Custom & Analog Routing: Manage the placement and custom routing strategies for critical Analog/Mixed-Signal (AMS) IPs, high-speed SerDes (PCIe, Ethernet, Memory interfaces), PLLs, and sensitive clock distributions.
• Power Delivery Network (PDN): Design and analyze the top-level power grid, ensuring robust power delivery for high-current AI workloads while minimizing IR drop.
• Pin Assignment & Feedthroughs: Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion.
• Methodology Development: Build and maintain scalable Floorplanning workflows and scripts (Tcl, Python) tailored for a lean, fast-moving start-up team.

Required Skills & Qualifications

• Experience: 12 + years of hands-on experience in Physical Design SoC Floor planning preferably in Datacenter domain, with at least 3 years acting as a lead or primary owner of SoC-level Floorplanning.

• Domain Expertise: Proven track record of taping out large, complex chips—specifically for Data Center, Networking, or AI/Machine Learningapplications.

• Start-Up Mentality: Highly driven, self-motivated, and comfortable with ambiguity. You take extreme ownership of your domain, pivot quickly when needed, and roll up your sleeves to get things done.