Silicon Packaging Engineer

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.

Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!

If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.

Lightmatter is (re)inventing the future of computing with light!

The Packaging team at Lightmatter 

We are building the world's first photonic engine for AI at scale, and packaging is where the physics meets the product. Our Silicon Packaging team works at the intersection of electrical, mechanical, optical, and thermal engineering to bring co-packaged optics from concept to high-volume production.

We're hiring across all levels  from juniors undergrads to PhD candidates for both internship and full-time new grad positions. Wherever you are in your academic journey, you'll work on real problems from day one alongside engineers who have shipped leading-edge products at the world's most demanding semiconductor in the world. Why should you apply? To have the best and most interesting internship experience! Packaging at Lightmatter means working on co-packaged optics for the AI infrastructure that doesn't exist yet and helping build the team and methods that will make it real.

Responsibilities

Depending on your background, you'll contribute to one or more of these areas:

• Signal & Power Integrity — high-speed interface analysis (PCIe, UCIe, SerDes), PDN design and simulation, eye diagrams, jitter, S-parameters
• Thermal Engineering — CFD simulation, heat sink and TIM evaluation, liquid cooling, package-level thermal analysis
• Mechanical & Thermo-Mechanical Design — structural analysis, tolerance stack-up, GD&T, FEA, solder fatigue, CTE mismatch
• Packaging Integration — 2.5D/3D packaging, fiber attach, heterogeneous integration, assembly yield and reliability

Qualifications

• Pursuing or recently completed a BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field
• Hands-on experience through coursework, capstone projects, research labs, or internships