Thermo-Mechanical Engineer

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.

Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!

If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.

Lightmatter is (re)inventing the future of computing with light!

In this role, you will work on leading-edge packaging technologies to enable AI architectures that will set new industry standards regarding compute power, performance, and efficiency.

You will collaborate with the packaging team to carry out the required structural analysis for packaging technologies under consideration, identify key failure modes under product use conditions, and run appropriate parametric studies to influence product and package design upstream. You will focus on thermo-mechanical analysis and characterization of advanced photonics packaging technologies, including 3D stack development, heterogeneous integration of lasers and novel fiber attach methods, to define design, material, and process solutions that successfully meet assembly and reliability requirements. The results of your work will lead to advanced package designs that meet power dissipation, optical, assembly, and reliability requirements while delivering a system-level solution for leading-edge products in the AI market.

Responsibilities: 

• Serve as the technical authority for thermo-mechanical simulation within the packaging organization, setting standards for model fidelity, validation methodology, and documentation practices adopted across the team.
• Identify capability gaps in simulation tooling, characterization methods, or material databases and champion fundamental investigations that strengthen the team's long-term technical foundation.
• Develop finite element stress, warpage, and assembly process models for wafer-level and unit-level photonic packaging, identifying design, process, and material parameters to mitigate failure modes and optimize yield.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and material solutions to improve product mechanical integrity.
• Conduct multi-physics simulations including solder collapse modeling for bump architecture definition and thermal-structural analysis for packaging stress to meet thermal, electrical, and optical requirements.