High-Speed Mixed-Signal Design Engineer

HIGH-SPEED MIXED SIGNAL DESIGN ENGINEER

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.

Our optical hardware platform requires tightly integrated high-speed electronic and photonic systems operating at tens of gigahertz and beyond—modulator drivers, trans-impedance amplifiers, SerDes interfaces, and the analog signal chains that connect them. We are seeking a High-Speed Mixed-Signal Design Engineer to architect, design, and validate the high-speed electronic systems that interface directly with our photonic integrated circuits. You will work across the boundary between electronics and photonics, from transistor-level circuit design through package and board-level integration, ensuring the electrical systems meet the bandwidth, linearity, and noise performance our optical links demand.

RESPONSIBILITIES:

• Design and analyze high-speed analog and mixed-signal circuits for electro-optic systems, including modulator drivers, TIAs, CTLEs, limiting amplifiers, and clock/data recovery circuits
• Develop and own circuit-level and system-level models for high-speed signal chains, incorporating device parasitics, package effects, and photonic component behavior
• Perform transistor-level simulation and verification using industry tools (e.g., Cadence Virtuoso, Spectre, ADS, HFSS) across process corners, temperature, and supply variation
• Architect high-speed electrical interfaces between electronic ICs and photonic integrated circuits, defining impedance matching, bandwidth targets, voltage swing, and power constraints
• Lead or contribute to chip-to-package-to-board co-design, including high-speed interconnect design, SI/PI analysis, and signal integrity closure from die through PCB
• Collaborate with PIC designers to co-optimize electro-optic performance across the driver–modulator and photodetector–TIA interfaces
• Define characterization and validation strategies for high-speed electronic and electro-optic subsystems, including S-parameter measurements, eye diagram analysis, and BER testing
• Analyze measurement data and correlate to simulation models, driving root-cause investigation and design iteration
• Partner with manufacturing and test engineering teams to develop production test methods for high-speed electrical and electro-optic assemblies
• Contribute to component selection, evaluation, and qualification for high-speed electronic devices (e.g., driver ICs, TIAs, CDRs, PLLs)

QUALIFICATIONS: