MMIC Design Engineer
US$150,000 – US$226,000 / yr base salary
Posted 5 Oct 2026
Advertised as “Lead/Principal MMIC Design Engineer”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 8+ yrs
- Management level
- People management
- Employment
- On-Site
| Base salary | US$150,000 – US$226,000 / yr |
|---|
Study levelDoctorate
Seeking a Lead MMIC Design Engineer for an exciting opportunity with the MMIC Technology Center organization under Honeywell Aerospace Inc., located in our Richardson, TX location! The MMIC Technology Center creates advanced RF solutions for internal and external customers. The Center has PMO, production test and support engineering to convert designs into delivered products as well as systems expertise to support customer architecture and trade studies at board and sub-array levels. Consider joining us! Apply today.
Work in a team environment to develop innovative, leading-edge GaN / GaAs technology MMICs ; ground and airborne-based radars, electronic warfare and space applications ranging from L-band to above Ka-band; assist in architecture development and feasibility studies; assist in advanced package concepts through development; perform modeling, simulations, and analyses necessary and hold successful design reviews with customers; assist in mask release to the foundry; assist in manufacturing & test readiness; work in lab alongside technicians to assist in validation & device characterization testing; prepare technical reports; collaborate with various organizations and cross-functional teams; work with internal and external vendors as required; support or lead in IR&D efforts; apply appropriate standards, processes, procedures and tools throughout the system development life cycle
Responsibilities
- Perform line-up analysis, floor planning, FET device selection, and circuit topology studies necessary to meet customer requirements.
- Perform circuit simulation, analyses, and layout as part of the design flow methodology.
- Perform circuit modeling and simulations using foundry PDK models (linear, non-linear, and EM).
- Perform 3D modeling and simulations for packaging MMIC’s; work with drafters and PCB designers to develop packages and/or multi-chip modules.
- Perform simulations using Cadence/AWR AXIEM 3D planar EM and Analyst 3D FEM tools.
- Perform analyses required to achieve reliability & manufacturing compliance.
- Prepare for design reviews and preparing for manufacturing and test readiness.
- Perform RF/Microwave measurements in the lab using PNA-X and related equipment.
- Lead Engineer to assist in planning, reporting, and meeting performance, cost, and schedule objectives on programs.
- Identify & initiate improvements in the design methodology flow
- Engage and forge relationships with foundries, advanced processes & packaging suppliers in order to advance our capabilities
- Assist in business development pursuits to help shape customer requirements and system architecture trades.
- Technical lead role; prepare flow-down specifications and floor planning requirements; prepare project status to Program Management and Engineering Manager.