Semiconductor Manufacturing Engineer

As a Semiconductor Manufacturing Engineer II here at Honeywell Aerospace, you will play a critical role in advancing MEMS and semiconductor manufacturing processes, driving innovation, and ensuring the production of high-quality silicon based devices. You will leverage your expertise in photolithography or wafer bonding processing to optimize manufacturing techniques, troubleshoot complex issues, collaborate with cross-functional teams to meet Honeywell Aerospace's MEMS and semiconductor technology goals.

You will report directly to our Wafer Fab Engineering Manager and you’ll work out of our Plymouth, MN location on an on-site work schedule.

In this role, you will impact Honeywell Aerospace’s ability to deliver cutting-edge MEMS and semiconductor products by improving manufacturing efficiency, reducing defects, supporting new technology integration, and specifying and qualifying new capital equipment, thereby contributing to the company’s growth and technological leadership.

Responsibilities

Key Responsibilities

• Develop and optimize MEMS photolithography (coat, expose, develop, & evaluate) and wafer bonding (align, process & evaluate) manufacturing processes to improve yield, quality, and throughput
• Troubleshoot photolithography and wafer bonding processes and understand components of variability to optimize process control, including implementing or changing control plans
• Troubleshoot and resolve complex manufacturing issues using advanced engineering principles and data analysis
• Collaborate with senior process engineers, design, quality, and production teams to implement process improvements and new technology integration

Qualifications

YOU MUST HAVE

• Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, mathematics
• 2 years of experience in semiconductor or MEMS manufacturing engineering or related process engineering roles
• Knowledge of process optimization, statistical process control (SPC), and design of experiments (DOE) setup and analysis
• USG security clearance in good standing, or US Citizenship with no known barriers to achieving USG Secret security clearance (non-citizens are ineligible for clearance).

WE VALUE

• Advanced degree in Electrical Engineering, Materials Science, Semiconductor Engineering, or related field
• Experience with semiconductor or MEMS fabrication processes and flows
• Experience with semiconductor or MEMS fabrication facilities and cleanroom environments