Semiconductor Manufacturing Engineer
US$114,000 – US$200,000 / yr base salary
Posted 24 Sep 2026
Advertised as “Senior Semiconductor Manufacturing Engineer”
BranchFactor Summary
The original posting with the fluff stripped out
- Management level
- People management
- Employment
- On-Site
- Visa sponsorship
- Not offered
| Base salary | US$114,000 – US$200,000 / yr |
|---|
Study levelBachelor's
Field of studyElectrical Engineering, Materials Science, Semiconductor Engineering
Study levelMaster's
As a Sr Semiconductor Manufacturing Engineer here at Honeywell Aerospace, you will play a critical role in advancing semiconductor and MEMS manufacturing processes, driving innovation, and ensuring the production of high-quality silicon based devices. You will leverage your expertise in thin film deposition processing to optimize manufacturing techniques, troubleshoot complex issues, collaborate with cross-functional teams to meet Honeywell's semiconductor and MEMS technology goals, provide technical guidance and mento junior engineers in thin films as well as the larger fab engineering team.
In this role, you will impact Honeywell Aerospace’s ability to deliver cutting-edge semiconductor and MEMS products by improving manufacturing efficiency, reducing defects, supporting new technology integration, and specifying and qualifying new capital equipment, thereby contributing to the company’s growth and technological leadership.
The annual base salary range for this position is $114,000 - $200,000. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.
You will report directly to our Wafer Fab Engineering Manager and you’ll work out of our Plymouth, MN location on an on-site work schedule.
Key Responsibilities
- Develop and optimize semiconductor and MEMS thin film deposition (PVD, evaporated metal, PECVD) manufacturing processes to improve yield, quality, and throughput
- Troubleshoot thin film deposition processes and understand components of variability to optimize process control, including implementing or changing control plans
- Troubleshoot and resolve complex manufacturing issues using advanced engineering principles and data analysis
- Collaborate with design, quality, and production teams to implement process improvements and new technology integration
Qualifications
YOU MUST HAVE
- Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, mathematics
- 5 years of experience in semiconductor or MEMS manufacturing engineering or related process roles
- Strong knowledge of semiconductor thin film deposition processes, equipment, and quality control methodologies
- Expertise in process optimization, statistical process control (SPC), and design of experiments (DOE) setup and analysis
- USG security clearance in good standing, or US Citizenship with no known barriers to achieving USG Secret security clearance (non-citizens are ineligible for clearance).