Quality Assurance Engineer
Posted 29 Jul 2026
Advertised as “Senior/Staff Quality Assurance Engineer or Manager (OSAT)”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 5+ yrs
- Management level
- Individual contributor
- Contract
- Full-time
No salary listed for this role.
Core Responsibilities:
Quality Management
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Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.
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Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.
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Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).
Problem Solving & Failure Analysis
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Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools.
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Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints.
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Support failure analysis activities and coordinate with engineering teams for resolution.
Process Control & Improvement
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Monitor process capability using SPC methodologies.
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Analyse yield, defect trends, and reliability data.
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Lead continuous improvement projects to reduce defects and improve yield performance.
Supplier & Customer Quality
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Support supplier audits and qualification activities.
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Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT.
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Manage the change control request review and approval, related to materials, processes, and equipment.
Audits & Compliance
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Conduct internal and external quality audits.
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Support customer audits and certification activities.
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Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.
Required Qualifications
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Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.
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5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs.
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Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly. Wafer & Final Test quality experience is an added advantage.
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Technical Skills:
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Statistical Process Control (SPC)
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Failure Analysis (FA)
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FMEA / PFMEA
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CAPA
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8D Problem Solving
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DOE (Design of Experiments)
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Yield Analysis & Defect Reduction
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Reliability Engineering
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QMS - ISO 9001, IATF 16949
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Minitab, JMP, Excel, SQL (preferred)
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Preferred Skills
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Strong analytical and troubleshooting skills.
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Excellent communication and presentation abilities.
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Experience working with OSAT subcontractors and cross-functional teams.
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Ability to manage multiple projects and drive quality improvements independently.