Product Development Manager

Req ID: 141516 
Remote Position: No
Region: Asia 
Country: Malaysia 
State/Province: Kedah 
City:  Kulim 

General Overview

Functional Area:  Engineering        
Career Stream:    Process Engineering Manufacturing    
SAP Short Name:  SLE-ENG-PRM
IC/MGR: Individual Contributor        
Direct/Indirect Indicator:  Indirect    

Summary

We are seeking a high-caliber Staff /Senior Lead Engineer, AI Hardware Product, representing the manufacturing site. In this role, you will lead a taskforce of cross-functional experts from Design Team, Customer, key suppliers, manufacturing site Process/Test/Debug/Quality Engineering to perform deep-dive failure root cause analysis and drive robust Corrective and Preventive Actions (CAPA).

You are a rare technical hybrid possessing unique, multi-domain expertise: a deeper understanding of semiconductor ICs/ASICs than anyone in Design Team or manufacturing site; superior insight into manufacturing and test processes compared to Design Team, suppliers, or customers; and stronger mastery of design and schematics than anyone else at the manufacturing site.

Knowledge/Skills/Competencies

● New Technology Integration: Rapidly assimilate new technologies, components, and architectural paradigms to assess technical feasibility, manufacturability, and commercial viability.
● Design-to-Operations Bridge: Collaborate closely with Hardware,Software, and Industrial Design teams to align product specifications with operational capabilities.
● DFX Leadership: Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews early in the product development lifecycle to eliminate downstream operational bottlenecks.
● NPI Process Development: Collaborate with Advanced Process Engineers to pioneer and optimize advanced manufacturing processes and test solutions for New Product Introduction (NPI) of next-generation products built on cutting-edge AI ASICs, high-density PCBs, and advanced high-speed connectors and cabling systems.
● NPI Execution: Lead build planning (EVT/DVT/PVT), yield improvement, product qualification, and mass-production ramp schedules across internal engineering and operations teams.
● Root Cause Analysis CAPA: Spearhead deep-dive investigation of complex hardware, IC/ASIC, and component failure modes and implement permanent CAPA.

● Cross-Functional Alignment: Serve as the central technical point of contact across Product Management, Design Engineering, Supply Chain, Quality, and Manufacturing Operations.

Typical Experience

● 10+ years of experience in Product Engineering, Hardware Engineering, or Technical Leadership driving failure analysis, CAPA, and yield improvement in high-tech manufacturing. ● Semiconductor ASIC Expertise: Superior understanding of semiconductor IC architecture, physics, and failure modes exceeding peer expertise in Design Team and manufacturing site. ● Design Process Mastery: Exceptional expertise in manufacturing and test processes, exceeding that of design engineers, suppliers, and customers,coupled with a comprehensive schematic and board design knowledge. ● Data-Driven Problem Solving: Strong analytical background skilled in root- cause analysis, statistical process control, and yield analysis. ● Cross-Functional & Supplier Leadership: Proven experience leading technical taskforces involving internal teams (Process, Test, Debug, Quality), Design Team, customers, and key IC vendors. ● AI Data Center Hyperscaler Architecture: Deep understanding of AI Data Center architecture, current and emerging technologies surrounding hyperscaler AI servers, switches, and storage, while continuously keeping pace with future technology developments and market releases.