Tech Integration Engineer
US$100,000 – US$160,000 / yr base salary
Posted 21 Sep 2026
Advertised as “Senior Tech Integration Engineer”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 7+ yrs
- Management level
- Individual contributor
| Base salary | US$100,000 – US$160,000 / yr |
|---|
Field of studyChemical Engineering, Chemistry, Electrical Engineering, Materials Science, Mechanical Engineering, Physics (or related)
Study levelBachelor's or higher
Company Description
Absolics Inc. is the world’s first glass substrate manufacturer and a leader in advanced packaging technologies. The company provides scalable solutions tailored for businesses in high-performance computing. Absolics pioneers innovative manufacturing techniques to support cutting-edge semiconductor advancements. Located in Covington, GA, the company is positioned at the forefront of the technology industry.
Position: Tech Integration Engineer
Location: COVINGTON, GA
JOB SUMMARY
The Tech Integration Engineer leads advanced packaging substrate integration from customer requirements through qualification and mass production. The role serves as the primary customer technical interface and owns cross-process gray-zone issues by aligning internal teams, identifying root causes, and driving timely resolution. Strong knowledge of advanced packaging and end-to-end substrate manufacturing is required.
DUTIES/RESPONSIBILITIES:
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Lead advanced packaging substrate integration from customer requirements and design review through qualification, ramp, and mass production.
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Serve as the primary customer technical interface and translate performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans.
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Maintain end-to-end understanding of substrate processes, including material preparation, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final quality assurance.
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Identify and resolve technical gray zones between process modules where ownership, specifications, or root causes are unclear.
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Lead cross-process troubleshooting for yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues.
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Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams to define ownership, containment, root cause, corrective actions, and closure timing.
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Establish process-interface criteria, monitor technical risks and key performance indicators, and communicate status to customers and management.
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Apply SPC, DOE, FMEA, and structured problem-solving methods to improve capability, yield, and reliability.
REQUIREMENTS:
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Strong understanding of advanced packaging technologies and end-to-end glass or organic substrate manufacturing.
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Ability to translate customer requirements into technical specifications, process flows, and qualification plans.