Package Design Engineer
Posted 11 Feb 2026
Advertised as “Advanced Package Design Engineer”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 3+ yrs
- Management level
- Individual contributor
No salary listed for this role.
Field of studyElectrical Engineering, Materials Science, Mechanical Engineering (or related)
Study levelBachelor's or higher
About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Job Summary:
We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions
Responsibilities:
- Design silicon and organic interposers for advanced packaging solutions
- Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
- Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
- Create and maintain layout design rules, stack-ups, and layout guidelines
- Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development
Qualifications:
- Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
- 3+ years of experience in semiconductor package design or layout
- Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
- Understanding of high-speed signal routing, power distribution networks (PDN)
- Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
- Effective communication skills and ability to work in a fast-paced, cross-functional environment
Preferred Qualifications:
- Currently pursuing a PhD's degree in Electrical Engineering or a related field