Role Overview

We are seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens-array and wafer-level micro-optical components for high-density photonic packages. You will translate system-level optical requirements into manufacturable designs, build tolerance budgets, work with fabrication and packaging partners, and close the loop with measured data.

Candidate note: We do not expect one person to match every item below. Strong candidates from micro-optics, optical packaging, semiconductor photonics, lithography/process integration, precision optics, or FDTD-Zemax co-design backgrounds are encouraged.

What You Will Do

• Own micro-optical design: design microlens arrays and compact micro-optical components, including lens pitch, aperture, focal length, numerical aperture, sag, surface form, fill factor, array uniformity, substrate, material, and coating choices.
• Build connected optical models: use tools such as Zemax OpticStudio, Code V, FRED, LightTools, VirtualLab, Ansys/Lumerical, COMSOL, or equivalent; combine ray, physical-optics, diffraction, and statistical methods where appropriate.
• Bridge EM-scale and package-scale design: where useful, connect FDTD, FEM, EME, RCWA, or similar electromagnetic simulations to Zemax/Code V/physical-optics models so local optical-interface behavior is represented in system-level trade studies.
• Drive tolerancing and yield: develop sensitivity studies and tolerance budgets across fabrication, placement, package stack-up, adhesive, thermal, refractive-index, coating, and surface-form variation; use Monte Carlo and DOE methods to connect design choices to expected yield.
• Bring semiconductor process awareness: partner with process and supplier teams across lithography, grayscale/direct-write patterning, imprint, etch transfer, deposition, thin-film coatings, wafer-level metrology, design rules, and process-window trade-offs.
• Translate design intent: create vendor-ready specifications, optical prescriptions, mechanical drawings and guidance, material and coating requirements, metrology plans, incoming inspection criteria, and acceptance criteria.
• Partner with suppliers: evaluate fabrication routes such as photoresist reflow, grayscale lithography, etch transfer, molding, and replication.
• Validate hardware: plan and run prototype characterization, including surface profile, focal length, array uniformity, optical throughput, reflection behavior, polarization sensitivity, thermal drift, environmental stability, and alignment sensitivity.