SOC Physical Verification & Integration Specialist
Posted 16 Jul 2026
Advertised as “Principal SOC Physical Verification & Integration Specialist”
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 14+ yrs
- Management level
- Individual contributor
- Employment
- Hybrid
No salary listed for this role.
Field of studyComputer Engineering, Electrical Engineering (or related)
Study levelBachelor's or higher
EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems.
The Role
We are seeking a thorough SOC Physical Verification & Integration Specialist to drive the physical assembly and signoff of our next-generation SOCs. In this role, you will own the physical integration strategy from the floorplan stage through to tapeout, ensuring seamless assembly of massive multi-hierarchical blocks. You will act as the critical bridge between block-level implementation, top-level integration, and final foundry signoff, ensuring that complex physical bottlenecks are resolved without compromising power, performance, or area (PPA).
Key Responsibilities
- Top-Level Physical Integration: Drive the full-chip physical assembly of very large-scale SOCs (e.g., multi-billion transistor designs). Manage top-level floorplanning, bump planning, global power grid (PG) integration, and top-level clock/routing integration.
- Hierarchical Verification Methodology: Architect and deploy highly efficient, hierarchical physical verification (PV) flows. Define the boundary conditions, abstraction models, and interface rules required to assemble heavily partitioned, massive-scale designs.
- Signoff Execution & Debugging: Own full-chip DRC, LVS, ERC, Antenna, ESD, and Latch-up signoff using industry-standard tools (e.g., Siemens Calibre) at advanced process nodes (5nm, 3nm, or below).
- Cross-Functional Collaboration: Partner tightly with the Physical Design (PD) and Static Timing Analysis (STA) teams. Proactively resolve integration conflicts—such as top-level routing congestion or interface timing violations—ensuring that physical fixes do not disrupt timing closure.
- Design Rule Co-Optimization: Work directly with foundry partners to interpret complex design rules and waive or resolve edge-case violations specific to reticle-limit designs.
- Automation & Flow Development: Develop robust scripts and utilities to automate physical integration tasks, database merging, and PV result parsing to accelerate the tapeout cycle.