On/Off-Chip SI/PI Engineer
Posted 28 Jul 2026
BranchFactor Summary
The original posting with the fluff stripped out
- Expected experience
- 3+ yrs
- Management level
- Individual contributor
- Employment
- On-Site
- Contract
- Full-time
No salary listed for this role.
Field of studyElectromagnetics, High-Speed Signaling, Power Integrity, RF/Microwave Engineering, Signal Integrity (or related)
Study levelMaster's or higher
About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Job Title: On/Off-Chip SI/PI Engineer
Office Location: San Jose, CA
Job Type: Full-Time
Work Model: Onsite
Job Summary:
This role serves as a critical technical liaison between HQ engineering teams and key U.S.-based customers, providing hands-on SI/PI analysis to resolve immediate HBM challenges. The position involves executing detailed signal and power integrity analyses while contributing to the development of advanced architectures for future HBM and DRAM products. By fostering deep technical partnerships, the successful candidate will ensure timely issue resolution and drive product optimization through close customer collaboration.
Responsibilities:
- Strengthen SI/PI capabilities for HBM, next-generation DRAM, and beyond.
- Drive system-level co-optimization beyond standalone DRAM design.
- Build deep technical partnerships with U.S.-based customers.
- Improve competitiveness through close engagement with customers in the U.S.
- Perform on-chip and off-chip SI/PI design and analysis for HBM and next-generation DRAM products.
- Verify system-level SI/PI robustness through integrated modeling and 3D electromagnetic analysis
- Analyze root causes of SI/PI issues and establish improvement plans.
- Participate in technical engagements with key customers.
- Leverage understanding of DRAM on-chip architecture and its electrical characteristics.
Qualifications:
- BS in Electrical Engineering or a related field with 3+ years of relevant experience in SI/PI engineering, or MS/Ph.D with a focus on signal/power integrity, high-speed signaling, electromagnetics, RF/microwave engineering, or a related field.